This is a 1:1 two-part thermally conductive silicone potting compound featuring zero small molecule outgassing during curing, outstanding thermal conductivity and superior flowability. It is suitable for potting electronic assemblies including high-power inverters and switching power supplies widely applied in new energy vehicles.

High thermal conductivity: 1.5-2.5 W / (m·K).

Low viscosity: 4000-15000 mPa·s.

Excellent aging performance.